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Solder Tin Paste 183 Degree Melting Point (XG-Z40) (Mechanic)

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$12.83

In stock

SKU 107082688131 Categories , , , , ,

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Description

    The BGA Flux Solder Paste is a high viscosity no-clean flux, it can be used for PCB, SMD, reworking, it can be used for soldering and reballing of computer and phone chips.
  • It is the mixture of high-quality alloyed powder and resinic pasty flux , it can avoid the pale yellow residue, so you are easy to clean the board.

Additional information

Weight 0.0100 kg

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