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Solder Paste Middle Board BGA Reballing SP-X By G-LON (ReLife)

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$25.25

In stock

SKU 107083002407 Categories , , ,

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Description

  • High density, high impedance.
  • Pure alloy composition.
  • Fine and sticky.
  • Low temperature Soldering tin Lead free Solder paste SP-X Middle solder paste 158degree, Lead free Solder paste.

Additional information

Weight 0.0100 kg

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