Solder Flux Paste Blue Bottle 100g (559) (Mechanic)

Description

• It can be used for rework sphere or pin attachment to bga pga and csp packages and assemble operations such as flip chip attachment to pwb substrates it is a necessary and helpful tool in bga reballing.
• Excellent capacity of solder-stickiness excellent anti-wet capacity widely used on bga pga csp packages and flip chip operation suitable for multiple pcb reflow no-clean and lead free for environmental protection.