Lead-Free Low Melt 38g BGA Solder Paste (Sn42/Bi58) – 138°C Melting Point (Meta Online)

No description available

$22.08

In stock

Share Product :

Facebook
Twitter
LinkedIn
Pinterest

Need this Part Installed?

Description

High-Viscosity No-Clean BGA Flux Solder Paste – 38g Syringe

Upgrade your soldering work with this High-Viscosity No-Clean BGA Flux Solder Paste, perfect for a wide range of electronic repairs and rework, including iPad, iPhone, PS5, PS4, and Xbox HDMI port replacements. It effectively reduces the melting point of old solder, ensuring a smoother and more efficient repair process.

  • Size: 38 grams in a generous syringe, offering great value compared to other brands.
  • Versatility: Ideal for reballing, SMD chip replacements, and various soldering tasks, including:
    • iPad, iPhone, PS5, PS4, and Xbox HDMI port repairs
    • Reballing and chip rework on phone and computer components
  • Longevity: 6 months shelf life after opening the syringe, ensuring long-lasting usability.
  • Performance: High viscosity formula with no-clean properties, perfect for PCB, SMD, and BGA work without leaving residue.
  • Efficiency: Reduces the melting point of old solder, improving the efficiency of your repairs and rework projects.

Additional information

Weight 0.0600 kg

Reviews

There are no reviews yet.

Be the first to review “Lead-Free Low Melt 38g BGA Solder Paste (Sn42/Bi58) – 138°C Melting Point (Meta Online)”