Bach 1.0 – Underfill Removal Blade
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$14.13
In stock
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Description
MACH BLADE SERIES – MA1.0 UNDERFILL REMOVAL BLADE
- This blade helps you removing underfill from the logic board around IC Chips to help the microsoldering process.
- 2mm blade easily copes with a variety of small size ic.
- 1. Heated by hot air gun,
- 2. Cut the side edge of the blade and take it out.
Additional information
| Weight | 0.0100 kg |
|---|
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