Solder Tin Paste 183 Degree Melting Point (XG-Z40) (Mechanic)
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$14.25
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Description
- The BGA Flux Solder Paste is a high viscosity no-clean flux, it can be used for PCB, SMD, reworking, it can be used for soldering and reballing of computer and phone chips.
- It is the mixture of high-quality alloyed powder and resinic pasty flux , it can avoid the pale yellow residue, so you are easy to clean the board.
Additional information
| Weight | 0.0100 kg |
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