Solder Flux Paste Blue Bottle 100g (559) (Mechanic)

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$22.62

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Description

  • It can be used for rework sphere or pin attachment to bga pga and csp packages and assemble operations such as flip chip attachment to pwb substrates it is a necessary and helpful tool in bga reballing.
  • Excellent capacity of solder-stickiness excellent anti-wet capacity widely used on bga pga csp packages and flip chip operation suitable for multiple pcb reflow no-clean and lead free for environmental protection.

Additional information

Weight 0.0100 kg

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