Solder Flux Paste 10cc 223 (Mechanic)

Description

The BGA Solder Paste is a high viscosity no-clean flux, it can be used for PCB, SMD, reworking, it can be used for soldering and reballing of computer and phone chips.
• BGA Soldering Paste Flux is the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale-yellow residue, so you are easy to clean the board.
• Soldering paste for cell phone PCB and SMD, electronics welding, soldering and etc.
• Help to repair the circuit boards and protect the electronic components.
• A necessary material for repairing the mobile phone mainboard.